SK hynix ships HBM4E samples, joining Samsung in next-gen AI memory race

SK hynix said Thursday it has shipped samples of its 12-layer HBM4E, the next generation of high-bandwidth memory for artificial intelligence, to major customers, moving the company into the customer-qualification stage roughly three weeks after rival Samsung Electronics claimed the industry's first such shipment. The announcement marks a shift in the HBM4E contest from product roadmaps to the more decisive phase in which AI chipmakers verify the memory inside their actual accelerator platforms.

By The Korea Herald

SK Hynix says ships samples of 12-layer next-gen HBM4E chips to major customers

SK Hynix ships samples of next-gen AI memory chips to major customers