SK hynix to break ground on $3.9b Indiana chip packaging plant this month

SK hynix will hold a groundbreaking ceremony on Aug. 27 for its $3.87 billion advanced chip packaging plant in Indiana, as the South Korean memory maker steps up its US expansion in artificial intelligence chip production. The ceremony will take place in West Lafayette, Indiana, where SK hynix is building an advanced packaging facility and research center for high-bandwidth memory, according to industry sources Thursday. The company has begun sending invitations to major customers and business p

By The Korea Herald