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Intel Appoints Seok-Hee Lee as EVP of Foundry Packaging
Intel has appointed industry veteran Seok-Hee Lee as Executive Vice President of Intel Foundry, where he will lead the company's packaging efforts. This appointment is part of Intel's broader manufacturing push.
18 Jun, 20:57 — 19 Jun, 06:04
The Story
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Source Diversity
Moderate (46/100)3 sources25/33
Spectrum spread— 2/5 buckets covered8/33
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Geographic diversity— 3 regions13/34
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Sources
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Korea HeraldMostly Factual7h ago
Intel hires former SK hynix chief Lee Seok-hee to lead advanced packaging
Intel has appointed former CEO of SK hynix and SK On Lee Seok-hee as a senior vice president in its foundry business, amid the US chipmaker’s push into advanced semiconductor packaging. Intel announced Thursday that Lee will oversee advanced packaging, system integration, back-end technology development and back-end manufacturing at Intel Foundry. He will report directly to CEO Lip-Bu Tan. Intel Foundry is establishing advanced packaging as a focused business with dedicated leadership, a directi
By The Korea Herald
Read full article →channel-news-asiaMostly Factual15h ago
Intel taps industry veteran Seok-Hee Lee to lead foundry packaging push
Read full article →seeking-alphaMixed16h ago
Intel appoints Seok‑Hee Lee as EVP of Intel Foundry amid manufacturing push
Read full article →Coverage Timeline
First report: seeking-alpha · 18 Jun, 20:57|Full coverage: 3 · 9h|Window: 9h
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