Hanwha Semitech unveils 2nd-generation hybrid bonder

Hanwha Semitech said Wednesday it has developed a second-generation hybrid bonder, a key technology for next-generation semiconductor packaging, and plans to deliver the equipment to customers for performance testing in the first half of this year. Hybrid bonders are regarded as a critical technology for improving the performance and manufacturing efficiency of high-bandwidth memory, a core component of AI accelerators. The South Korean-based chip equipment maker said the new system, dubbed SHB2

By The Korea Herald