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Powertech Targets World's First Panel-Level Packaging for AI Chips by 2027

Semiconductor manufacturer Powertech plans to pioneer panel-level packaging technology aimed at accelerating AI chip production, marking a significant shift in advanced semiconductor manufacturing.

27 Aug, 02:17 — 27 Aug, 02:17
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nikkei-asiaHigh15h ago

Powertech eyes world's first panel-level packaging for AI chips in 2027

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